Tuesday, June 18, 2024
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USI Empowers Smart Cockpit System Innovation with Excellent Modular Design Capability

SHANGHAI, July 19, 2023 /PRNewswire/ — With the booming development of electric vehicles and advanced driver-assistance systems, the automotive industry is entering a rapidly evolving era of smart driving. To enhance performance and passenger experience, numerous automakers are actively incorporating cutting-edge electronic devices and technologies, striving to achieve more advanced driver’s cockpit systems. In this flourishing field, USI (SSE: 601231) is collaborating with multiple automotive SoC solution providers (TP) to accelerate the development of smart cockpit systems by leveraging its years of expertise in System-in-Package (SiP) and System-on-Module (SoM) modules, effectively reducing the size of automotive compute modules while ensuring the highest operational speed of DDR.

USI Automotive Compute Module
USI Automotive Compute Module

Modern smart cockpit systems have evolved beyond limited infotainment functions such as CD players, USB, and Bluetooth connectivity. They now encompass a wide range of rich features, including passenger entertainment displays, panoramic assistance displays, heads-up displays, digital instrument clusters, driver detection, passenger detection, voice-controlled temperature adjustment, voice-controlled music playback, and message transmission. These advancements allow drivers to experience a prestigious cockpit similar to that of an aircraft, greatly enhancing driving comfort, improving handling performance, and reducing driver fatigue.

Smart cockpit systems not only fulfill the role of a mobile personal entertainment center but also continuously innovate in line with the evolving trends of artificial intelligence (AI) assistance, advanced connectivity (C-V2X), advanced driver-assistance systems (ADAS), and software-defined vehicles (SDV). These trends will further drive the development of smart cockpit systems in the following application scenarios:

  • Intelligent Human-Machine Interface: Touchscreen interfaces have become the mainstream method of interaction today. However, in the future, with the gradual integration of artificial intelligence (AI) assistance, traditional physical touchscreens may gradually be replaced by advanced voice control, gesture control, and even eye-tracking control.
  • Diversified Cabin Functions: The future smart cockpit will integrate fully autonomous driving technology and become a versatile center for smart office and entertainment. Drivers and passengers will be able to engage in office work, meetings, multimedia entertainment, and other activities within the vehicle cabin.

Based on these development trends, it is evident that there will be a significant increase in market demand for System-on-Chips (SoCs) and active/passive electronic components. With the improvement in CPU processing speed and the expansion of functionalities, using traditional chip-on-board solutions would require mainboards to transition to high-density interconnect (HDI) PCBs with 10 or more layers. However, modular design can reduce motherboard PCB stack-up and design complexity.

USI adopts advanced underfill, BGA (Ball Grid Array) mounting, embedded passive components, and high-density SMT (Surface Mount Technology) process technology to develop automotive compute modules. These modules encompass crucial control components such as System-on-Chips (SoCs), dynamic random-access memory (DDR), and power management integrated circuits (PMICs), which are independent of the mainboard. This modular design reduces the mainboard’s footprint and enhances computational performance, including processing speed and power distribution network performance, thereby improving the quality and efficiency of the smart cockpit system. Simultaneously, carmakers can focus on mainboard development, reducing overall development time and saving on research and development costs. Furthermore, the adoption of automotive compute modules can lower the mainboard’s cost for manufacturers and facilitate the implementation of high-density PCB designs within smaller module areas.

USI has been dedicated to driving innovation in automotive technology and has extensive experience in the development of automotive compute module products. The company can provide a wide range of high-quality advanced automotive compute modules, delivering a safer, more convenient, and exciting driving experience for drivers and passengers of new-generation vehicles. USI’s solutions not only offer comprehensive technical support to automotive manufacturers but also achieve improvements in product quality and performance, reduce development time, and lower research and development costs.

As the market for smart cockpit systems continues to evolve, USI will continue to lead the automotive industry into this new era, injecting strong momentum into the intelligent development of the future automotive industry.

About USI (SSE: 601231)

USI, Universal Scientific Industrial (Shanghai) Co., Ltd., is a global leader in electronic design and manufacturing as well as a leader in the field of SiP (System-in-Package) modules. USI provides D(MS)2 product services: Design, Manufacturing, Miniaturization, Industrial software and hardware Solutions, and material procurement, logistics and maintenance Services. With Asteelflash, USI has 28 sales, production and service locations across four continents of Asia, Europe, Americas and Africa, and offers customer diversified products in the sectors of wireless communication, computer and storage, consumer, industrial, medical and automotive electronics worldwide. USI is a subsidiary of ASE Technology Holding Co., Ltd. (TWSE: 3711, NYSE: ASX). To learn more, please visit www.usiglobal.com and engage with us on LinkedIn and YouTube.